Focuses on the research and development, manufacturing, and technical services of industrial cleaning equipment
Cleaning Process for PCB Boards
Compared with various other cleaning methods, ultrasonic cleaning is the perfect choice for PCB board cleaning.
The high cleaning effectiveness of ultrasonic cleaning machines benefits from the penetrability and cavitation shock waves generated by sound waves propagating in the medium. Therefore, it easily cleans components with complex shapes, inner cavities, and fine holes. For general processes such as oil removal, rust prevention, and phosphating, they can be completed in just two to three minutes under the action of ultrasonic waves.
Its speed is several to dozens of times faster than traditional methods, and the cleanliness can meet high standards. In many scenarios where high requirements are placed on product surface quality and productivity, it more prominently demonstrates results that are difficult to achieve or irreplaceable by other treatment methods.
Principle of Ultrasonic Cleaning
The cleaning of flux residues is mainly achieved through a dissolution process. Whether it is rosin, organic acids, or their tin salts or lead salts, they have a certain solubility in cleaning agents. The removal of residues is completed through the transfer process from the circuit board surface to the cleaning agent.
During the dissolution process, increasing the temperature of the cleaning agent, or using Fuli Electromechanical ultrasonic cleaning machines and brushing as auxiliary methods, can accelerate the cleaning speed and improve the cleaning effect. However, a more reliable method is to use ultrasonic cleaning.
Classification of Residues
Residues on PCB boards after printed circuit board soldering can be roughly divided into three categories:
Particulate contaminants— Dust, lint, and solder balls. Solder balls are a type of soldering defect. If the vibration of the circuit board ultrasonic cleaning machine causes a large number of small solder balls to gather in one area, it may cause electrical short circuits. Solder balls can be removed through cleaning.
Non-polar contaminants— Rosin resin, paraffin, anti-oxidation oil used in wave soldering, as well as cosmetics or handwashing agents left by operators.
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